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 HCC/HCF4510B HCC/HCF4516B
PRESETTABLE UP/DOWN CUNTERS
.MEDI .SYNCHRONOUSI .RESETANDPRESETCAPABI .QUI .5V,10V,AND15VPARAMETRI .I .100%TESTEDFORQUI .MEETSALLREQUI
UM SPEED OPERATION fCL = 8MHz TYP. AT 10V NTERNAL CARRY PROPAGATION LITY ESCENT CURRENT SPECIFIED TO 20V FOR HCC DEVICE C RATINGS NPUT CURRENT OF 100nA AT 18V AND 25C FOR HCC DEVICE ESCENT CURRENT REMENTS OF JEDEC TENTATIVE STANDARD No. 13A, "STANDARD SPECIFICATIONS FOR DESCRIPTION OF "B" SERIES CMOS DEVICES"
EY (Plastic Package)
F (Ceramic Package)
M1 (Micro Package)
C1 (Chip Carrier)
DESCRIPTION The HCC4510B, HCC4516B (extended temperature range) and the HCF4510B, HCF4516B (intermediate temperature range) are monolithic integrated circuits available in 16-lead dual in-line plastic or ceramic package and plastic micro package. The HCC/HCF4510B Presettable BCD Up/Down Counter and the HCC/HCF4516B Presettable Binary Up/Down Counter consist of four synchronously clocked D-type flip-flops (with a gating structure to provide T-type flip-flop capability) connected as counters. These counters can be cleared by a high level on the RESET line, and can be preset to any binary number present on the jam inputs by a high level on the PRESET ENABLE line. The HCC/HCF4510B will count out of non-BCD counter states in a maximum of two clock pulses in the up mode, and a maximum of four clock pulses in the down mode. If the CARRY-IN input is held low, the counter advances up or down on each positive-going clock transition. Synchronous cascading is accomplished by connecting all clock inputs in parallel and connecting the CARRY-OUT of a less significant stage to the CARRY-IN of a more significant stage. The HCC/HCF4510B and HCC/HCF4516B can be cascaded in the ripple mode by connecting the CARRY-OUT to the clock of the next stage. If the UP/DOWN input changes during a terminal count, the CARRY-OUT must be gated with the clock, and the UP/DOWN input must change while the clock is high. This method provides a clean clock signal to the subsequent counting stage.
November 1996
ORDER CODES : HCC45XXBF HCF4516BM1 HCF45XXBEY HCF45XXBC1
PIN CONNECTIONS
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HCC/HCF4510B/4516B
FUNCTIONAL DIAGRAM
CL X - -/ - -/ X X
X = Don't care.
CI 1 0 0 X X
U /D X 1 0 X X
PE 0 0 0 1 X
R 0 0 0 0 1
Action No Count Count Up Count Down Preset Reset
ABSOLUTE MAXIMUM RATINGS
Symbol V DD * VI II Pto t Parameter Supply Voltage : HC C Types H C F Types Input Voltage DC Input Current (any one input) Total Power Dissipation (per package) Dissipation per Output Transistor for T o p = Full Package-temperature Range Operating Temperature : HCC Types H CF Types Storage Temperature Value - 0.5 to + 20 - 0.5 to + 18 - 0.5 to V DD + 0.5 10 200 100 - 55 to + 125 - 40 to + 85 - 65 to + 150 Unit V V V mA mW mW C C C
T op T stg
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functionnal operation of the device at these or any other conditions above those indicated in the operationale sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to VSS pin voltage.
RECOMMENDED OPERATING CONDITIONS
Symbol V DD VI Top Parameter Supply Voltage : HC C Types H CF Types Input Voltage Operating Temperature : HCC Types H CF Types Value 3 to + 18 3 to + 15 0 to V DD - 55 to + 125 - 40 to + 85 Unit V V V C C
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HCC/HCF4510B/4516B
LOGIC DIAGRAMS
4510B
4516B
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HCC/HCF4510B/4516B
TIMING DIAGRAMS
4510B
4516B
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HCC/HCF4510B/4516B
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Test Conditions Symbol Parameter VI (V) 0/ 5 HCC 0/10 Types 0/15 0/20 0/ 5 HCF 0/10 Types 0/15 VOH Output High Voltage 0/ 5 0/10 0/15 VOL Output Low Voltage 5/0 10/0 15/0 VIH Input High Voltage 0.5/4.5 1/9 4.5/0.5 9/1 0/ 5 0/ 5 HCC Types 0/10 0/15 0/ 5 0/ 5 HCF Types 0/10 0/15 IOL Output Sink Current 0/ 5 HCC 0/10 Types 0/15 0/ 5 HCF 0/10 Types 0/15 IIH, IIL Input Leakage Current HCC 0/18 Types HCF Types 0/15 Any Input 2.5 4.6 9.5 13.5 2.5 4.6 9.5 13.5 0.4 0.5 1.5 0.4 0.5 1.5 <1 <1 <1 <1 <1 <1 <1 <1 <1 <1 VO (V) | IO | (A) V DD (V) 5 10 15 20 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 5 10 15 5 5 10 15 5 10 15 5 10 15 18 Any Input 15 0.3 10 5
-5
Value T Lo w* Min. Max. Min. 5 10 20 100 20 40 80 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 -2 - 0.64 - 1.6 - 4.2 - 1.53 - 0.52 - 1.3 - 3.6 0.64 1.6 4.2 0.52 1.3 3.6 0.1 - 1.6 - 3.2 - 0.51 - 1 - 1.3 - 2.6 - 3.4 - 6.8 - 1.36 - 3.2 - 0.44 - 1 - 1.1 - 2.6 - 3.0 - 6.8 0.51 1.3 3.4 0.44 1.1 3.0 1 2.6 6.8 1 2.6 6.8 10-5 0.1 0.3 7.5 3.5 7 11 1.5 3 4 - 1.15 - 0.36 - 0.9 - 2.4 - 1.1 - 0.36 - 0.9 - 2.4 0.36 0.9 2.4 0.36 0.9 2.4 1 A 1 pF mA mA 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 V V 25 C 0.04 0.04 0.04 0.08 0.04 0.04 0.04 5 10 20 100 20 40 80 4.95 9.95 14.95 0.05 0.05 0.05 V V T High* Max. 150 300 600 3000 150 300 600 A Unit Typ. Max. Min.
IL
Quiescent Current
1.5/13.5 < 1 VIL Input Low Voltage
13.5/1.5 < 1 IOH Output Drive Current
CI
Input Capacitance
* TLo w= - 55C for HCC device : - 40C for HCF device. * THigh= + 125C for HCC device : + 85C for HCF device. The Noise Margin for both "1" and "0" level is : 1V min. with VDD = 5V, 2V min. with VDD = 10V, 2.5 V min. with VDD = 15V.
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HCC/HCF4510B/4516B
DYNAMIC ELECTRICAL CHARACTERISTICS (T amb = 25C, C L = 50pF, R L = 200k typical temperature coefficient for all V DD values is 0.3%/C, all input rise and fall times = 20ns)
Symbol Parameter Test Conditions V D D (V) Min. 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 2 10 4 15 5.5 5 150 10 75 15 60 5 150 10 80 15 60 5 10 15 5 130 10 60 15 45 5 360 10 160 15 110 5 220 10 100 15 75 Value Typ. Max. 200 400 100 200 75 150 210 420 105 210 80 160 240 480 120 240 90 180 125 250 60 120 50 100 320 640 160 320 125 250 100 200 50 100 40 80 4 8 11 Unit
t P HL , t P L H Propagation Delay Time Clock to Q Output t P HL , t P L H Propagation Delay Time Preset or Reset to Q Output t P HL , t P L H Propagation Delay Time Clock to Carry Out t P HL , t P L H Propagation Delay Time Carry in to Carry Out t P HL , t P L H Propagation Delay Time Preset or Reset to Carry Out t THL , t T L H Transition Time
ns
ns
ns
ns
ns
ns
f max
Max. Clock Frequency
MHz
tW
Clock Pulse Width
ns
*Preset Enable or Reset Removal Time t r, tf *Clock Rise and Fall Time
ns 15 5 5
s
t se t u p
Carry in Setup Time
ns
t se t u p
Up-down Setup Time
ns
tW
Preset Enable or Reset Pulse Width
ns
* Time
required after the falling edge of the reset or preset enable inputs before the rising edge of the clock will trigger the counter (similar to setup time). * If more than unit is cascaded in the parallel clocked application, trCL should be made less than or equal to the sum of the fixed propagation delay at 15pF and the transition time of the carry output driving stage for the estimated capacitive load.
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HCC/HCF4510B/4516B
Typical Output Low (sink) Current Characteristics. Minimum Output Low (sink) Current Characteristics.
Typical Output High (source) Current Characteristics.
Minimum Output High (source) Current Characteristics.
Typical Propagation Delay Time vs. Load Capacitance for Clock to Q Output.
Typical Maximum Clock Input Frequency vs. Supply Voltage.
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HCC/HCF4510B/4516B
Typical Transition Time vs. Load Capacitance. Typical Dynamic Power Dissipation vs. Frequency.
TYPICAL APPLICATIONS TYPICAL 16-CHANNEL, 10 BIT DATA ACQUISITION SYSTEM
This acquisition system can be operated in the random access mode by jamming in the channel number at the present inputs, or in the sequential mode by clocking the HCC/HCF4516B.
8/14
HCC/HCF4510B/4516B
CASCADING COUNTER PACKAGES
TEST CIRCUITS Quiescent Device Current. Noise Immunity.
Input Leakage Current.
Power Dissipation and Input Waveform.
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HCC/HCF4510B/4516B
Plastic DIP16 (0.25) MECHANICAL DATA
mm MIN. a1 B b b1 D E e e3 F I L Z 3.3 1.27 8.5 2.54 17.78 7.1 5.1 0.130 0.050 0.51 0.77 0.5 0.25 20 0.335 0.100 0.700 0.280 0.201 1.65 TYP. MAX. MIN. 0.020 0.030 0.020 0.010 0.787 0.065 inch TYP. MAX.
DIM.
P001C
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HCC/HCF4510B/4516B
Ceramic DIP16/1 MECHANICAL DATA
mm MIN. A B D E e3 F G H L M N P Q 7.8 2.29 0.4 1.17 0.22 0.51 0.38 17.78 2.79 0.55 1.52 0.31 1.27 10.3 8.05 5.08 0.307 0.090 0.016 0.046 0.009 0.020 3.3 0.015 0.700 0.110 0.022 0.060 0.012 0.050 0.406 0.317 0.200 TYP. MAX. 20 7 0.130 MIN. inch TYP. MAX. 0.787 0.276
DIM.
P053D
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HCC/HCF4510B/4516B
SO16 (Narrow) MECHANICAL DATA
DIM. MIN. A a1 a2 b b1 C c1 D E e e3 F G L M S 3.8 4.6 0.5 9.8 5.8 1.27 8.89 4.0 5.3 1.27 0.62 8 (max.) 0.149 0.181 0.019 10 6.2 0.35 0.19 0.5 45 (typ.) 0.385 0.228 0.050 0.350 0.157 0.208 0.050 0.024 0.393 0.244 0.1 mm TYP. MAX. 1.75 0.2 1.65 0.46 0.25 0.013 0.007 0.019 0.004 MIN. inch TYP. MAX. 0.068 0.007 0.064 0.018 0.010
P013H
12/14
HCC/HCF4510B/4516B
PLCC20 MECHANICAL DATA
mm MIN. A B D d1 d2 E e e3 F G M M1 1.27 1.14 7.37 1.27 5.08 0.38 0.101 0.050 0.045 9.78 8.89 4.2 2.54 0.56 8.38 0.290 0.050 0.200 0.015 0.004 TYP. MAX. 10.03 9.04 4.57 MIN. 0.385 0.350 0.165 0.100 0.022 0.330 inch TYP. MAX. 0.395 0.356 0.180
DIM.
P027A
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HCC/HCF4510B/4516B
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequ ences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical compone in life support devices or systems without express nts written approval of SGS-THOMSON Microelectonics. (c) 1996 SGS-THOMSON Microelectronics - Printed in Italy - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A .
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